JPS6155874A - 高密度実装基板用コネクタ - Google Patents
高密度実装基板用コネクタInfo
- Publication number
- JPS6155874A JPS6155874A JP59178796A JP17879684A JPS6155874A JP S6155874 A JPS6155874 A JP S6155874A JP 59178796 A JP59178796 A JP 59178796A JP 17879684 A JP17879684 A JP 17879684A JP S6155874 A JPS6155874 A JP S6155874A
- Authority
- JP
- Japan
- Prior art keywords
- connector
- board
- printed
- connection
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000006071 cream Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000000742 single-metal deposition Methods 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59178796A JPS6155874A (ja) | 1984-08-28 | 1984-08-28 | 高密度実装基板用コネクタ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59178796A JPS6155874A (ja) | 1984-08-28 | 1984-08-28 | 高密度実装基板用コネクタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6155874A true JPS6155874A (ja) | 1986-03-20 |
JPH0142580B2 JPH0142580B2 (en]) | 1989-09-13 |
Family
ID=16054793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59178796A Granted JPS6155874A (ja) | 1984-08-28 | 1984-08-28 | 高密度実装基板用コネクタ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6155874A (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0379170U (en]) * | 1989-12-06 | 1991-08-12 |
-
1984
- 1984-08-28 JP JP59178796A patent/JPS6155874A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0379170U (en]) * | 1989-12-06 | 1991-08-12 |
Also Published As
Publication number | Publication date |
---|---|
JPH0142580B2 (en]) | 1989-09-13 |
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